Sigma Mechotronics Pvt. Ltd.

SLDM-200 Laser Wafer Dicing Machine

Specify Model No. and Data Sheet/Manual Machine drawing and other details of Machine beside image, details of Machine on Dicing/Cutting of Silicone/Glass. Data sheet should provide set of information on Dicing data variation for different type of wafers :

Model No. SLDM-200 Laser Wafer Dicing Machine

Data Sheet :

🔹 General Specifications

Parameter	Specification
Machine Type	Laser Wafer Dicing Machine
Operation Mode	Semi Automatic
Application	Semiconductor Wafer Dicing
Supported Wafer Size	Up to 200 mm
Wafer Thickness Range	10 µm – 200 µm

🔹 Laser Specifications

Parameter	Specification
Laser Type	Pulsed Laser
Wavelength	532 nm (Green)
Pulse Mode	Pulsed
Beam Size	10 -20 µm
Warranty	3 year

🔹 Motion & Accuracy

Parameter	Specification
Axis	X, Y, Z
Working Area	150x150x75 mm
Positioning Accuracy	≤ ±5 µm
Repeatability	≤ ±5 µm
Max Cutting Speed	≥ 50 mm/s
Cutting Method	Monitoring Assisted with Vision

🔹 Vision & Alignment

Feature	Description
Camera System	High-Resolution CCD
Alignment	Automatic Street Alignment
Safety Features	Emergency Stop and Safety Locks

🔹 Different Type of wafers/Materials Compatibility

Material	Supported
Silicon (Si)	Yes
Silicon Carbide (SiC)	Yes
Gallium Nitride (GaN)	Yes
Gallium Arsenide (GaAs)	Yes
Glass / Molded Wafers	Yes

🔹 Utilities Requirements

Utility	Requirement
Output Power & Electrical Requirement	8w/230VAC
Compressed Air	0.5–0.7 MPa
Nitrogen	0.3–0.5 MPa (Optional)
Cooling	DI Water Cooled Chiller
Exhaust	Laser Fume Exhaust Port
Warm up time	< 5minutes

🔹 Physical Specifications

Parameter	Specification
Footprint (W×D×H)	Approx. 1650 × 1700 × 1800 mm
Weight	Approx. 2500 kg
Cleanroom Compatibility	Semiconductor Cleanroom

Laser Source data sheet is missing. Clarify make/Model and Data sheet of Laser used.

Green Pulsed DPSS Laser (532 nm)

🔹 General Specifications

Parameter	Specification
Laser Type	Diode Pumped Solid State (DPSS), Pulsed
Wavelength	532 nm (Green)
Operation Mode	Pulsed (Q-switched / ns or ps)
Beam Mode	TEM₀₀
Application	Wafer dicing, micromachining, PCB cutting

🔹Optical Specifications

Parameter	Typical Value
Average Power	20 W – 80 W (typical industrial range)
Pulse Width	< 20–30 ns
Repetition Rate	50 – 300 kHz
Pulse Energy	up to ~1–3 mJ
Beam Quality (M²)	< 1.2
Beam Diameter (Output)	~1–3 mm
Beam Divergence	< 2–10 mrad
Polarization	Linear (100:1)

🔹 Focused Beam (Process Output)

Parameter	Value
Focused Spot Size	10 – 20 µm
Method	F-theta lens / objective lens
Use Case	Wafer dicing / precision cutting

🔹 Stability & Performance

Parameter	Specification
Pulse-to-Pulse Stability	< 2% RMS
Power Stability	< 3% over 12 hrs
Pointing Stability	< 20 µrad/°C

🔹 Electrical & Interface

Parameter	Specification
Input Voltage	24 V DC
Communication	RS232 / Ethernet
Triggering	External TTL
Control	Software GUI

🔹 Mechanical & Environmental

Parameter	Specification
Cooling	Water-cooled
Operating Temp	15 – 35 °C
Humidity	20–80% (non-condensing)